Stéphane Moreau

Post-doctoral position at the Back-End Laboratory of the CEA-LETI (Grenoble, France).
- Reliability of copper interconnects (nodes beyond 65 nm) under thermo-electrical stress: test setting up (LabVIEW), tests (influence of geometry, materials…), lifetime estimation and failure mechanism determination.
- Development of a finite element model in order to understand the adhesive and cohesive ruptures appearing during the Chemical-Mechanical Polishing (CMP) step and to find solutions to reduce the stress state of the system.
=> Implementation under ANSYS of the Virtual Crack Closure Technique (VCCT) for the Energy Release Rate (ERR) calculus (fracture mechanics).

Sector: Electronics and microelectronics

Power Microelectronics Laboratory (Laboratoire de Microélectronique de Puissance, LMP – Tours, France)
- Thermo-mechanical simulations of 3D capacitors (DIOS, FLOOPS, ANSYS) to understand the cracks appearing during manufacturing process.
- Modal and electro-structural analyses (ANSYS) for MEMS for medical imaging.
- Thermo-mechanical characterization (DMA method) of Pb-Sb-Sn solder.

Sector: Electronics and microelectronics

PhD with STMicroelectronics and the Power Microelectronics Laboratory (Laboratoire de Microélectronique de Puissance, LMP – Tours, France): “Thermo-mechanical reliability of power electronic devices”.
- Comparison of TRIAC reliability according to TCT and TST tests.
- Lifetime estimation through statistical analyses (Weibull++ software).
- Failure analyses (micro-sections, X-ray, SAM, SEM).
- Thermo-mechanical characterization (DTA, TMA, DMA methods) of metals and alloys (especially on solders), epoxy resins and ceramics.
- 3-D FE simulations (ANSYS): failure mode establishing (resulting of statistical and failures analyses and simulations), parameters extraction of different lifetime models (strain and energy-based models), lifetime estimation.

- In charge of the invitation to tender for a DMA.
Supervision of trainees working on ANSYS simulations and/or reliability studies.

Sector: Electronics and microelectronics