Pierre De Sola

English | French

Since 2007: ASIC designer - Coolsand Technologies (China)

2007 : Intership (6 month) - SAGEM Communication

2006 : Research Internship (3 month) - Nanyang Technological University

2005 : Internship (2 month) - Rockwell & Collins

2004 : Shop-floor traineeship (1 month) - France Beurre