Camille Tellier

Test and Product Engineering for RF IC's:

· Development of Test Programs used in the factories for IC test after packaging: test programs are used in all phases of the product life, prototyping, characterization, qualification, ramp up and mass production.

· Product characterization and assessment in collaboration with the Design and Failure analysis teams.

· Yield, Test Time, Test throughput and Cost optimization in collaboration with fabrication sites.

Ballet, tennis, discovery of new cultures (travelling).